Closer Look: ADATA AX3U2400W4G11
ADATA went for an industrial futuristic look with the heat shroud for the XPG V2 line of memory modules. The sharp angles and lines, especially on the gold modules, make it look like the XPG V2 would fit perfectly in the next Transformers movie, don’t you think? ADATA certainly does. I definitely like the look of DRAM modules, and if you have case that adequately shows off your components, they could add a nice touch to the appearance.
Of course, one of my absolute favorite features of the AX3U2400W4G11 DRAM Kit is the easy open tab on the packaging. I was pleasantly surprised when I didn’t have to run and find a pair of industrial strength scissors or a knife to cut through the plastic shell made to protect against a nuclear attack. As it stands, the AX3U2400W4G11 packaging was easy to open and the modules, though securely held in place, were easy to remove. I am often afraid of destroying RAM modules before they ever make it into a system because they are often so difficult to get out of the package.
The ADATA XPG V2 line of DRAM kits runs the full gamut of 8GB and 16GB kits, starting at the low end with DDR3-1600 kits and running all the way up to DDR3-3100 kits. As you could see from the chart on the previous page, however, the timings increased with the DRAM speeds. The DDR3-1600 kits have relatively low timings at CL9-9-9-24 and those increase up to CL12-14-14-36 at the DDR3-3100 level. The AX3U2400W4G11 DRAM kit that we are testing with today sits between those two with timings at CL11-13-13-35.
ADATA touts the XPG V2 Series heat sink covers more surface area than previous versions and provides better thermo-conductivity, thus keeping the DRAM cool more efficiently. Cooler operation and better thermo-conductivity also improves power consumption and helps ensure a higher level of signal completion. The AX3U2400W4G11 is built on a 2oz double-copper 8-layer PCB for better stability. ADATA calls this system Thermal Conductive Technology (TCT).