Phenom-II X4-975BE Features

AMD64 with Direct Connect Architecture

• Helps improve system performance and efficiency by directly connecting the processors, the memory controller, and the I/O to the CPU.
• Designed to enable simultaneous 32- and 64-bit computing
• Integrated Memory Controller
  • Benefits: Increases application performance by dramatically reducing memory latency
  • Scales memory bandwidth and performance to match compute needs
  • HyperTransport Technology provides up to 16.0GB/s peak bandwidth per processor-reducing I/O bottlenecks
  • Up to 37GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)

AMD Balanced Smart Cache

• Shared L3 cache (either 6MB or 4MB)
• 512K L2 cache per core
  • Benefit: Shortened access times to the highly accessed data for better performance.

AMD Wide Floating Point Accelerator

• 128-bit floating point unit (FPU)
• High performance (128bit internal data path) floating point unit per core.
  • Benefit: Larger data paths and quicker floating point calculations for better performance.

HyperTransport Technology

• One 16-bit link at up to 4000MT/s
• Up to 8.0GB/s HyperTransport I/O bandwidth; Up to 16GB/s in HyperTransport Generation 3.0 mode
• Up to 37GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)
  • Benefit: Quick access times to system I/O for better performance.

Integrated DRAM Controller with AMD Memory Optimizer Technology

• A high-bandwidth, low-latency integrated memory controller
• Supports PC2-8500 (DDR2-1066); PC2-6400 (DDR2-800), PC2-5300 (DDR2-667), PC2-4200 (DDR2-533) or PC2-3200 (DDR2-400) SDRAM unbuffered DIMMs - AM2+
• Support for unregistered DIMMs up to PC2 8500 (DDR2-1066MHz) and PC3 10600 (DDR3-1333MHz) - AM3
• Up to 17.1GB/s memory bandwidth for DDR2 and up to 21GB/s memory bandwidth for DDR3
  • Benefit: Quick access to system memory for better performance.

AMD Virtualization (AMD-V) Technology With Rapid Virtualization Indexing

• Silicon feature-set enhancements designed to improve the performance, reliability, and security of existing and future virtualization environments by allowing virtualized applications with direct and rapid access to their allocated memory.
  • Benefit: Helps virtualization software to run more securely and efficiently enabling a better experience when dealing with virtual systems

AMD PowerNow! Technology (Cool'n'Quiet Technology)

• Enhanced power management features which automatically and instantaneously adjusts performance states and features based on processor performance requirements
• For quieter operation and reduced power requirements
  • Benefit: Enables cooler and quieter platform designs by providing extremely efficient performance and energy usage.

AMD CoolCore Technology

• Reduces processor energy consumption by turning off unused parts of the processor. For example, the memory controller can turn off the write logic when reading from memory, helping reduce system power.
• Works automatically without the need for drivers or BIOS enablement.
• Power can be switched on or off within a single clock cycle, saving energy with no impact to performance.
  • Benefit: Helps users get more efficient performance by dynamically activating or turning off parts of the processor.

Dual Dynamic Power Management

• Enables more granular power management capabilities to reduce processor energy consumption.
• Separate power planes for cores and memory controller, for optimum power consumption and performance, creating more opportunities for power savings within the cores and memory controller.
  • Benefit: Helps improve platform efficiency by providing on demand memory performance while still allowing for decreased system power consumption

HDZ975FBGMBOX Specifications

• Model Number & Core Frequency: X4-975 / 3.6GHz (Black Edition)
• OPN: HDZ975FBGMBOX ("M" indicates new revision)
• L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (512KB total L1 per processor)
• L2 Cache Sizes: 512KB of L2 data cache per core (2MB total L2 per processor)
• L3 Cache Size: 6MB (shared)
• Total Cache (L2+L3): 8MB
• Memory Controller Type: Integrated 128-bit wide memory controller *
• Memory Controller Speed: Up to 2.0GHz with Dual Dynamic Power Management
• Types of Memory Supported: Unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz)
• HyperTransport 3.0 Specification: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
• Total Processor-to-System Bandwidth: Up to 37.3GB/s total bandwidth [Up to 21.3 GB/s memory bandwidth
• (DDR3-1333) + 16.0GB/s (HT3)]
• Up to 33.1GB/s total bandwidth [Up to 17.1 GB/s memory bandwidth (DDR2-1066) + 16.0GB/s (HT3)]
• Packaging: Socket AM3 938-pin organic micro pin grid array (micro-PGA)
• Fab location: GLOBALFOUNDARIES Fab 1 module 1 in Dresden, Germany (formerly AMD Fab 36)
• Process Technology: 45-nanometer DSL SOI (silicon-on-insulator) technology
• Approximate Die Size: 258mm2
• Approximate Transistor count: ~758 million
• Max Temp: 62 degrees Celsius
• Nominal Voltage: 0.825-1.4V
• Max TDP: 125 Watts
• MSRP: $195 USD

*Note: configurable for dual 64-bit channels for simultaneous read/writes

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