Athlon-II X4 AM3 Features

AMD Direct Connect Architecture

An award-winning technology designed to reduce bottlenecks that can exist when multiple components compete for access to the processor bus. Competing x86 systems use a single front-side bus (FSB) which must carry memory access, graphics, and I/O traffic. Eliminate the FSB, and you can reduce delays that competing access requests can cause.

45 nm Process Technology with Immersion Lithography

More efficient process technology with cutting-edge lithographic performance puts more transistors in less space.

AMD Wide Floating Point Accelerator

Doubles processor bandwidth from 64- to a full 128-Bit Floating-Point math processing pipeline that can double many of the bandwidth paths that help keep it full.

AMD Digital Media XPress 2.0 Technology

Provides support for SSE, SSE2, SSE3, SSE4a, and MMX instructions for digital media applications and security.

CPU Architectural Features

True Multi-Core Processing

The extensive AMD64 architectural optimizations and features enable thorough integration of multiple cores within the same processor, with each core having its own L1 and L2 caches.

AMD Dedicated Multi-Cache

Each core has its own dedicated L2 cache, which enables simultaneous independent core access to L2 cache, eliminating the need for cores to arbitrate for cache access. This helps reduce latency on L2 cache accesses.

AMD Virtualization (AMD-V) Technology

Silicon feature-set enhancements designed to improve the performance, reliability, and security of both existing and future virtualization environments.

AMD PowerNow! 3.0 Technology

The latest power management technologies that deliver performance on demand when you need it, and power savings when you don't.

HyperTransport 3.0 Technology

Third-generation HyperTransportTM interface improves performance, supporting transfer speeds up to 4.4GT/s.

Simultaneous 32-bit and 64-bit Computing

AMD64 technology enables a breakthrough approach to 64-bit computing that doubles the number of registers in the processor and allows PC users to use today's 32-bit software applications while enabling them to also use the next generation of 64-bit applications.

Cool'n'Quiet 3.0 Technology

Up to eight different performance states help enhance power efficiency. Simplified performance state transitions can reduce latency and the software overhead of performance state changes.

AMD Dynamic Power Management

Each processor core, and the integrated memory controller and HyperTransportTM controller, is powered by dedicated voltage planes.

Integrated Dual-Channel Memory Controller

Directly connects the processor to memory for optimum performance, low latency, and high throughput.

Multi-Point Thermal Control

The next-generation design features multiple on-die thermal sensors with digital interface. Automatic reduction of p-state when temperature exceeds pre-defined limit. Additional memory thermal management interface.

AMD CoolCore Technology

Coarse and fine transistor control that can automatically reduce processor energy consumption by turning off unused parts of the processor.

ADX645WFGMBOX Specifications

• Model Number & Core Frequency: X4-645 @ 3.1GHz
• TRAY OPN# ADX645WFGMBOX
• PIB OPN# ADX645WFGMBOX
• L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (384KB total L1 per processor)
• L2 Cache Sizes: 512KB of L2 data cache per core (1.5MB total L2 per processor)
• Memory Controller Type: Integrated 128-bit wide memory controller *
• Memory Controller Speed: 2.0GHz with Dual Dynamic Power Management
• Types of Memory Supported: Support for unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz)
• HyperTransport 3.0 Specification: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
• Total Processor-to-System Bandwidth: Up to 37.3 GB/s bandwidth [Up to 21.3 GB/s total bandwidth (DDR3-1333) + 16.0GB/s (HT3)]
• Packaging: Socket AM3 938-pin organic micro pin grid array (micro-PGA)
• Fab location: GLOBALFOUNDRIES Fab 1 Module 1
• Process Technology: 45-nanometer DSL SOI (silicon-on-insulator) technology
• Approximate Die Size: 169 mm2
• Approximate Transistor count: ~ 300 million
• Max Temp: 71 Celsius
• Core Voltage: 1.05-1.4V
• Max TDP: 95 Watts
• AMD Codename: "Propus"
• MSRP: $122

  *Note: configurable for dual 64-bit channels for simultaneous read/writes

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