Phenom II X2 AM3 Black Edition Features

Ready to accelerate
Take performance over the top with AMD Phenom^TM II processors and AMD OverDrive^TM software. Second generation AMD Phenom^TM II processors feature a refined architecture, the award-winning innovation of AMD64 technology with Direct Connect Architecture, and 45nm technology for maximum performance headroom.

Beyond specifications
Tune performance with the superior headroom of AMD Phenom^TM II processors and AMD OverDrive^TM software. Combined with ATI Radeon^TM HD graphics cards, they deliver extreme visual performance and the ability to control and monitor system functions.

Total system performance
Build a total system tuned for performance, beginning with an all-AMD solution including AMD Phenom^TM II processors, AMD chipsets, and ATI Radeon^TM HD graphics with CrossFireX^TM technology for multi-GPU support. Experience the power of gaming beyond high definition.

HDZ550WGIBOX Specifications

• Model Number & Core Frequency: X2 550 Black Edition = 3.1GHz
• TRAY OPN# HDZ550WFK2DGI
• PIB OPN# HDZ550WGIBOX
• L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (256KB total L1 per processor)
• L2 Cache Sizes: 512KB of L2 data cache per core (1MB total L2 per processor)
• L3 Cache Size: 6MB (shared)
• Memory Controller Type: Integrated 128-bit wide memory controller *
• Black Edition processors support software selectable increases to memory controller, HyperTransport, DDR3 and CPU core frequency.
• Memory Controller Speed: 2.0GHz with Dual Dynamic Power Management
• Types of Memory Supported: Support for unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz)
• HyperTransport 3.0 Specification: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
• Total Processor-to-System Bandwidth: Up to 37.3GB/s bandwidth [Up to 21.3 GB/s total bandwidth (DDR3-1333) + 16.0GB/s (HT3)]
• Up to 33.1GB/s bandwidth [Up to 17.1 GB/s total bandwidth (DDR2-1066) + 16.0GB/s (HT3)]
• Packaging: Socket AM3 938-pin organic micro pin grid array (micro-PGA)
• Fab location: GLOBALFOUNDRIES Fab 1 Module 1
• Process Technology: 45-nanometer DSL SOI (silicon-on-insulator) technology
• Approximate Die Size: 258 mm2
• Approximate Transistor count: ~ 758 million
• Max Temp: 70o Celsius
• Core Voltage: 0.850-1.425V
• Max TDP: 80 Watts
• MSRP: $102

*Note: configurable for dual 64-bit channels for simultaneous read/writes

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